Desktop Dispensing Machine for Semiconductor Underfill Process
The VS300 Series Desktop Visual Dispensing Machine is an efficient and flexible micro-dispensing solution specially developed for semiconductor underfill, IC encapsulation, micro-assembly, and other precision electronics manufacturing tasks.
To address the strict requirements of modern underfill processes, the VS300 is equipped with real-time fluid level detection and alarm, helping prevent production interruptions due to sudden material depletion. Users can also configure the system with an optional rotation module for complex multi-angle dispensing tasks, as well as a bottom heating module to optimize material flow and curing during underfill or dam & fill applications.
Core Advantages
● Compact & Flexible Desktop Design: Small footprint makes it easy to install in labs, pilot lines, or cleanroom workbenches.
● Level Detection with Alarm: Integrated fluid level monitoring avoids defects caused by unexpected glue depletion.
● Optional Rotation & Heated Base Modules: The rotation module enables precise multi-angle dispensing, and the bottom heating option improves underfill fluidity and curing consistency.
● High Precision & Visual Alignment: Vision-based fiducial recognition and closed-loop motion ensure stable dot size and accurate glue placement for micro-scale underfill.
Applications
✔ Semiconductor chip underfill (BGA, CSP, Flip-Chip)
✔ MEMS component encapsulation
✔ Dam & Fill and corner bonding processes
✔ IC package sealing for prototyping and pilot runs
✔ Micro-assembly glue dispensing in lab-scale electronics production
Technical Specifications
| VS300 Series Desktop Visual Dispensing Machine |
| Motion System |
4-axis (X/Y/Z + Rotation) |
| Transmission |
Servo motor & screw module |
| Repeatability |
X/Y: ±0.015mm |
| Positioning Accuracy |
X/Y: ±0.025mm |
| Max Speed |
X/Y: 500mm/s, Z: 300mm/s |
| Max Acceleration |
X/Y: 0.5g, Z: 0.3g |
| Max Fixture Load |
10 kg |
| Visual Positioning |
Mark / product feature recognition |
| Identify Accuracy |
±1 pixel |
| Power Supply |
220V AC, 50Hz, 500W |
| Air Inlet |
0.5 Mpa, 150L/min |
FAQ
Q1: How does the level detection help during underfill processes?
A: The built-in level detection sensor triggers an alarm when adhesive runs low, preventing incomplete fills and ensuring stable production without manual checks.
Q2: What’s the benefit of the rotation module?
A: The optional rotation module allows precise multi-angle dispensing on IC packages with tight corners or complex contours, reducing manual repositioning.
Q3: Why is a heated base important for underfill?
A: Bottom heating improves the flowability of underfill adhesives, helping the material penetrate tight gaps under the chip and ensuring void-free bonding.
Q4: Can the VS300 series handle different glue types?
A: Yes, the system is compatible with various piezoelectric valves, which can deal with a variety of adhesives, including epoxy, UV-curable, and high-viscosity underfill materials. Process parameters can be easily adjusted in the software.
Conclusion
Whether you are a semiconductor lab, a prototype packaging house, or a precision electronics maker looking for stable, flexible, and accurate underfill dispensing, the VS300 Series Desktop Visual Dispensing Machine delivers the advanced features you need—without the footprint or cost of large inline systems.
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Semiconductor Underfill Desktop Glue Dispensing Machine automated 10KG lab Images
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