Micro volume dispensing Piezo Jet Valve in Micro vibration motor (LRA/ERM) assembly
The KPS2000 piezo jet valve is a high-performance non-contact dispensing solution optimized for precision adhesive applications in micro vibration motor (LRA/ERM) assembly. Leveraging advanced piezoelectric actuation, the KPS2000 delivers fast, accurate, and repeatable jetting of adhesives in micro volumes—ideal for delicate components such as miniature motors and flexible circuit connections used in smartphones, wearables, and haptic devices.
At the core of the KPS2000’s operation is its piezo actuator, which precisely controls the movement of a plunger to eject adhesive droplets without physical contact with the substrate. This enables high-frequency dispensing with exceptional consistency, even in tight spaces or on sensitive components. The non-contact nature of the jetting process helps prevent damage to the motor or PCB during assembly, while eliminating stringing, overflow, or contamination.
The KPS2000 supports a wide range of adhesives with viscosities between 1–500000 cps. Its modular design and nozzle/tappet options make it adaptable to a variety of motor designs and production line configurations.
Core Advantages
Key advantages of the KPS2000 for micro motor dispensing include:
- Non-contact jetting to protect sensitive components and ensure clean, precise application
- High-speed dispensing to meet demanding production throughput
- Micro-volume control for consistent adhesive dots as small as nanoliters
- Excellent repeatability to ensure uniform bonding and high product reliability
- Easy integration into automated systems with vision alignment and motion control
Main appliaction
- Bonding of motor housing and PCB
- Bonding of FPC flexible circuit board
- Dispensing of anti-vibration/buffer glue
- Sealing/insulating glue Encapsulating key parts to prevent water vapor, dust or conductive particles from entering
- Stable dispensing track and uniform glue curing
Technical parameters
| KPS2000 piezoelectric valve |
| Pressure supply range |
0.1～8 Bar |
| Viscosity range |
Medium or high viscosity up to 500000mpas |
| Max jetting frequency |
1200Hz |
| Work temperature range |
10～50°C |
| Outer Size |
Valve: 125.5×75×20mm(Includes runner assembly)
Controller: 232×170×165 mm
|
| Total Weight |
430g+3.55kg |
FAQ
Q1:Why is a piezo jet valve recommended for dispensing adhesives in micro vibration motor assembly?
A1: Piezo jet valves provide non-contact, high-precision adhesive dispensing, which is essential for handling small, delicate components like vibration motors. They eliminate the risk of damaging sensitive parts and ensure consistent dot size and placement accuracy.
Q2: What types of adhesives can be used with piezo jet valves in vibration motor bonding?
A2: Compatible adhesives include UV-curable adhesives for fast curing, epoxy for structural bonding, silicone for damping or cushioning, and even conductive adhesives for grounding or EMI shielding in specialized designs.
Q3: How does the non-contact dispensing process benefit vibration motor production?
A3: Non-contact jetting avoids mechanical contact, reducing stress on the motor or PCB. It also allows precise dispensing in hard-to-reach areas and minimizes adhesive contamination, overflow, or inconsistent dots.
Q4: Can the piezo valve handle ultra-small adhesive volumes required for compact motors?
A4: Yes, piezo jet valves can dispense controlled volumes in the nanoliter range, enabling precise adhesive application for tiny bonding areas commonly found in LRA and ERM motor assemblies.
Q5: What factors should I consider when selecting a jet valve for micro motor applications?
A5: Key factors include adhesive type and viscosity, required dot size, dispensing speed, system integration capability, and repeatability. A high-frequency, maintenance-friendly valve like the KPS2000 offers excellent performance for this use case.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.
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